In-situ measurements of internal stresses in copper thin films during thermal cycling using synchrotron X-rays.

Details

Language :

English

ISBNs :

9780780386075

Database :

Complementary Index

Journal :

Micro-Nanomechatronics & Human Science, 2004 & the Fourth Symposium Micro-Nanomechatronics for Information-Based Society, 2004

Publication Type :

Conference

Accession number :

81190498

Full Text :

https://doi.org/10.1109/MHS.2004.1421279