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Characteristics of Ni electroformed micro connector used for high density packaging.

Authors :
Unno, T.
Toriyama, T.
Isono, Y.
Sugiyama, S.
Source :
Micro-Nanomechatronics & Human Science, 2004 & the Fourth Symposium Micro-Nanomechatronics for Information-Based Society, 2004; 2004, p105-108, 4p
Publication Year :
2004

Details

Language :
English
ISBNs :
9780780386075
Database :
Complementary Index
Journal :
Micro-Nanomechatronics & Human Science, 2004 & the Fourth Symposium Micro-Nanomechatronics for Information-Based Society, 2004
Publication Type :
Conference
Accession number :
81190504
Full Text :
https://doi.org/10.1109/MHS.2004.1421285
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