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Effect of facility for hot spot reduction of inter-level dielectric (ILD) CMP process.
- Source :
- Proceedings of 2001 International Symposium on Electrical Insulating Materials (ISEIM 2001) 2001 Asian Conference on Electrical Insulating Diagnosis (ACEID 2001). 33rd Symposium on Electrical & Ele; 2001, p95-98, 4p
- Publication Year :
- 2001
Details
- Language :
- English
- ISBNs :
- 9784886860538
- Database :
- Complementary Index
- Journal :
- Proceedings of 2001 International Symposium on Electrical Insulating Materials (ISEIM 2001) 2001 Asian Conference on Electrical Insulating Diagnosis (ACEID 2001). 33rd Symposium on Electrical & Ele
- Publication Type :
- Conference
- Accession number :
- 81223772
- Full Text :
- https://doi.org/10.1109/ISEIM.2001.973573