Development of high accuracy wafer thinning and pickup technology for thin wafer(die).

Details

Language :

English

ISBNs :

9781424475933

Database :

Complementary Index

Journal :

2010 IEEE CPMT Symposium Japan

Publication Type :

Conference

Accession number :

81341228

Full Text :

https://doi.org/10.1109/CPMTSYMPJ.2010.5679528