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Damage risk assessment of under-pad structures in vertical wafer probe technology.

Authors :
Hauck, T.
Schmadlak, I.
Argento, C.
Muller, W.H.
Source :
2009 European Microelectronics & Packaging Conference; 2009, p1-5, 5p
Publication Year :
2009

Details

Language :
English
ISBNs :
9781424447220
Database :
Complementary Index
Journal :
2009 European Microelectronics & Packaging Conference
Publication Type :
Conference
Accession number :
81440703

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