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Damage risk assessment of under-pad structures in vertical wafer probe technology.
- Source :
- 2009 European Microelectronics & Packaging Conference; 2009, p1-5, 5p
- Publication Year :
- 2009
Details
- Language :
- English
- ISBNs :
- 9781424447220
- Database :
- Complementary Index
- Journal :
- 2009 European Microelectronics & Packaging Conference
- Publication Type :
- Conference
- Accession number :
- 81440703