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Three dimensional interconnects with through silicon vias and electroplating solder microbumps.

Authors :
Tsai, G.
Chen, S.
Chien-Feng Chan
Chun-Chieh Chao
Chi-Hsin Chiu
Chiu, S.
Chen, C.
Source :
Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2010 5th International; 2010, p1-5, 5p
Publication Year :
2010

Details

Language :
English
ISBNs :
9781424497836
Database :
Complementary Index
Journal :
Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2010 5th International
Publication Type :
Conference
Accession number :
81451505
Full Text :
https://doi.org/10.1109/IMPACT.2010.5699627
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