Models for physics of failures analysis during printed circuit board bending.

MLA

Jan-Long Yang, and Mei-Ling Wu. “Models for Physics of Failures Analysis during Printed Circuit Board Bending.” Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International, Jan. 2011, pp. 474–77. EBSCOhost, https://doi.org/10.1109/IMPACT.2011.6117282.

APA

Jan-Long Yang, & Mei-Ling Wu. (2011). Models for physics of failures analysis during printed circuit board bending. Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International, 474–477. https://doi.org/10.1109/IMPACT.2011.6117282

Chicago

Jan-Long Yang, and Mei-Ling Wu. 2011. “Models for Physics of Failures Analysis during Printed Circuit Board Bending.” Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT), 2011 6th International, January, 474–77. doi:10.1109/IMPACT.2011.6117282.