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The effect of plasma etching process on rigid flex substrate for electronic packaging application.
- Source :
- 2009 International Conference on Electronic Packaging Technology & High Density Packaging; 2009, p937-940, 4p
- Publication Year :
- 2009
Details
- Language :
- English
- ISBNs :
- 9781424446582
- Database :
- Complementary Index
- Journal :
- 2009 International Conference on Electronic Packaging Technology & High Density Packaging
- Publication Type :
- Conference
- Accession number :
- 81511807
- Full Text :
- https://doi.org/10.1109/ICEPT.2009.5270560