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Replication of micro and sub-micro structures by means of hot embossed polymer inserts.

Authors :
Kolew, A.
Sikora, K.
Munch, D.
Worgull, M.
Source :
2010 Symposium on Design Test Integration & Packaging of MEMS/MOEMS (DTIP); 2010, p339-343, 5p
Publication Year :
2010

Details

Language :
English
ISBNs :
9781424466368
Database :
Complementary Index
Journal :
2010 Symposium on Design Test Integration & Packaging of MEMS/MOEMS (DTIP)
Publication Type :
Conference
Accession number :
81598388

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