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Sub-modeling technique for thermo-mechanical simulation of solder microbumps assembly in 3D chip stacking.
- Source :
- 11th Electronics Packaging Technology Conference, 2009. EPTC '09; 2009, p591-595, 5p
- Publication Year :
- 2009
Details
- Language :
- English
- ISBNs :
- 9781424450992
- Database :
- Complementary Index
- Journal :
- 11th Electronics Packaging Technology Conference, 2009. EPTC '09
- Publication Type :
- Conference
- Accession number :
- 81603365
- Full Text :
- https://doi.org/10.1109/EPTC.2009.5416481