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Stability of J-integral calculation in the crack growth of copper/low-K stacked structures.
- Source :
- Thermal & Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006 (ITHERM 2006); 2006, p885-891, 7p
- Publication Year :
- 2006
Details
- Language :
- English
- ISBNs :
- 9780780395244
- Database :
- Complementary Index
- Journal :
- Thermal & Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006 (ITHERM 2006)
- Publication Type :
- Conference
- Accession number :
- 81670185
- Full Text :
- https://doi.org/10.1109/ITHERM.2006.1645440