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Multi-VT engineering in highly scaled CMOS bulk and FinFET devices through Ion Implantation into the metal gate stack featuring a 1.0nm EOT high-K oxide.

Authors :
Singanamalla, R.
Boccardi, G.
Tseng, J.
Petry, J.
Vellianitis, G.
van Dal, M.J.H.
Duriez, B.
Vecchio, G.
Bulle-Lieuwma, C.W.T.
Berkum, J.V.
Lander, R.
Mu?ller, M.
Source :
2010 International Symposium on VLSI Technology Systems & Applications (VLSI-TSA); 2010, p112-113, 2p
Publication Year :
2010

Details

Language :
English
ISBNs :
9781424450633
Database :
Complementary Index
Journal :
2010 International Symposium on VLSI Technology Systems & Applications (VLSI-TSA)
Publication Type :
Conference
Accession number :
81674326
Full Text :
https://doi.org/10.1109/VTSA.2010.5488925