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Combination of MEMS processing and electroless copper plating for a novel RF inductor.

Authors :
Yi Li
WenGang Wu
YiLong Hao
Source :
Proceedings 7th International Conference on Solid-State & Integrated Circuits Technology, 2004; 2004, p1703-1703, 1p
Publication Year :
2004

Details

Language :
English
ISBNs :
9780780385115
Database :
Complementary Index
Journal :
Proceedings 7th International Conference on Solid-State & Integrated Circuits Technology, 2004
Publication Type :
Conference
Accession number :
81872619
Full Text :
https://doi.org/10.1109/ICSICT.2004.1435160