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Reducing wearout in embedded processors using proactive fine-grain dynamic runtime adaptation.
- Source :
- 2012 17TH IEEE EUROPEAN TEST SYMPOSIUM (ETS); 1/ 1/2012, p1-6, 6p
- Publication Year :
- 2012
-
Abstract
- With shrinking feature sizes, transistor aging becomes a reliability challenge for embedded processors. Processes such as NBTI and HCI lead to increasing gate delays and eventually reduced lifetime. Currently, to ensure functionality for a certain lifetime, safety margins are added to the design, which means overdesign and increased costs. To extend lifetime, reduce power and heat, while maintaining the required performance we propose a dynamic runtime adaptation approach, which is based on runtime monitoring of temperature, performance, power and wearout in combination with fine-grained proactive dynamic voltage and frequency scaling. The experimental results presented in this work show lifetime improvements between 63% up to 5×, while the required performance as well as power and temperature constraints are maintained. [ABSTRACT FROM PUBLISHER]
Details
- Language :
- English
- ISBNs :
- 9781467306966
- Database :
- Complementary Index
- Journal :
- 2012 17TH IEEE EUROPEAN TEST SYMPOSIUM (ETS)
- Publication Type :
- Conference
- Accession number :
- 86497029
- Full Text :
- https://doi.org/10.1109/ETS.2012.6233012