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3D FinFET and other sub-22nm transistors.
- Source :
- 2012 19th IEEE International Symposium on the Physical & Failure Analysis of Integrated Circuits; 1/ 1/2012, p1-5, 5p
- Publication Year :
- 2012
-
Abstract
- FinFET provides needed relief to ICs from performance, power, and device variation predicaments. It also provides higher carrier mobility, especially at low voltage near the threshold voltage, giving promise to practical near-threshold circuits. Another new transistor conceived simultaneously with FinFET, UTB-SOI FET, is also entering production. Together they showed a new scaling path forward: scale the body thickness in proportion to gate length. [ABSTRACT FROM PUBLISHER]
Details
- Language :
- English
- ISBNs :
- 9781467309806
- Database :
- Complementary Index
- Journal :
- 2012 19th IEEE International Symposium on the Physical & Failure Analysis of Integrated Circuits
- Publication Type :
- Conference
- Accession number :
- 86499606
- Full Text :
- https://doi.org/10.1109/IPFA.2012.6306337