An experimental methodology for the in-situ observation of the time-dependent dielectric breakdown mechanism in Copper/low-k on-chip interconnect structures.

Details

Language :

English

ISBNs :

9781479901128

Database :

Complementary Index

Journal :

2013 IEEE International Reliability Physics Symposium (IRPS)

Publication Type :

Conference

Accession number :

89798539

Full Text :

https://doi.org/10.1109/IRPS.2013.6531966