Back to Search Start Over

EMI associated with inter-board connection for module-on-backplane and stacked-card configurations.

Authors :
Ye, X.
Nadolny, J.
Drewniak, J.L.
Hubing, T.H.
Vaudoren, T.P.
DuBroff, D.E.
Source :
1999 IEEE International Symposium on Electromagnetic Compatability Symposium Record (Cat No99CH36261); 1999, Issue 2, p797-797, 1p
Publication Year :
1999

Details

Language :
English
ISBNs :
9780780350571
Issue :
2
Database :
Complementary Index
Journal :
1999 IEEE International Symposium on Electromagnetic Compatability Symposium Record (Cat No99CH36261)
Publication Type :
Conference
Accession number :
92136087
Full Text :
https://doi.org/10.1109/ISEMC.1999.810121