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Technical trends of LSI packaging: recent advances in CSPs and high density substrates.
- Source :
- 1999 Symposium on VLSI Circuits Digest of Papers (IEEE Cat No99CH36326); 1999, p69-72, 4p
- Publication Year :
- 1999
Details
- Language :
- English
- ISBNs :
- 9784930813954
- Database :
- Complementary Index
- Journal :
- 1999 Symposium on VLSI Circuits Digest of Papers (IEEE Cat No99CH36326)
- Publication Type :
- Conference
- Accession number :
- 92140533
- Full Text :
- https://doi.org/10.1109/VLSIC.1999.797239