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Silicon on aluminum nitride structures formed by wafer bonding.

Authors :
Bengtsson, S.
Choumas, M.
Maszara, W.P.
Bergh, M.
Olesen, C.
Sodervall, U.
Litwin, A.
Source :
Proceedings IEEE International SOI Conference; 1994, p35-36, 2p
Publication Year :
1994

Details

Language :
English
ISBNs :
9780780324060
Database :
Complementary Index
Journal :
Proceedings IEEE International SOI Conference
Publication Type :
Conference
Accession number :
92246026
Full Text :
https://doi.org/10.1109/SOI.1994.514222