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High-performance VLSI through package-level interconnects.

Authors :
Liang, L.
Wilson, J.D.
Brathwaite, N.
Mosley, L.E.
Love, D.
Source :
Proceedings, 39th Electronic Components Conference; 1989, p518-523, 6p
Publication Year :
1989

Details

Language :
English
Database :
Complementary Index
Journal :
Proceedings, 39th Electronic Components Conference
Publication Type :
Conference
Accession number :
92343366
Full Text :
https://doi.org/10.1109/ECC.1989.77799