Electrical performance analysis of a three-dimensional package.

MLA

Seung-Ho Ahn, et al. “Electrical Performance Analysis of a Three-Dimensional Package.” Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium “Manufacturing Technologies - Present & Future,” Jan. 1995, pp. 112–19. EBSCOhost, https://doi.org/10.1109/IEMT.1995.526102.

APA

Seung-Ho Ahn, Kyung-Sun Lee, Se-Young Oh, & Miersch, E. (1995). Electrical performance analysis of a three-dimensional package. Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium “Manufacturing Technologies - Present & Future,” 112–119. https://doi.org/10.1109/IEMT.1995.526102

Chicago

Seung-Ho Ahn, Kyung-Sun Lee, Se-Young Oh, and E. Miersch. 1995. “Electrical Performance Analysis of a Three-Dimensional Package.” Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium “Manufacturing Technologies - Present & Future,” January, 112–19. doi:10.1109/IEMT.1995.526102.