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Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips.

Authors :
Xiaoxian, Liu
Zhangming, Zhu
Yintang, Yang
Fengjuan, Wang
Ruixue, Ding
Source :
Journal of Semiconductors; Jan2014, Vol. 35 Issue 1, p015008-015015, 8p
Publication Year :
2014

Details

Language :
English
ISSN :
16744926
Volume :
35
Issue :
1
Database :
Complementary Index
Journal :
Journal of Semiconductors
Publication Type :
Academic Journal
Accession number :
94292918
Full Text :
https://doi.org/10.1088/1674-4926/35/1/015008