Cite

Insertion loss characterization of tightly spaced interconnects with an embedded patterned layer.

MLA

Vargas, Marcos A., and Kathleen L. Melde. “Insertion Loss Characterization of Tightly Spaced Interconnects with an Embedded Patterned Layer.” 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging & Systems, Jan. 2013, pp. 21–24. EBSCOhost, https://doi.org/10.1109/EPEPS.2013.6703458.



APA

Vargas, M. A., & Melde, K. L. (2013). Insertion loss characterization of tightly spaced interconnects with an embedded patterned layer. 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging & Systems, 21–24. https://doi.org/10.1109/EPEPS.2013.6703458



Chicago

Vargas, Marcos A., and Kathleen L. Melde. 2013. “Insertion Loss Characterization of Tightly Spaced Interconnects with an Embedded Patterned Layer.” 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging & Systems, January, 21–24. doi:10.1109/EPEPS.2013.6703458.