Early detection for Cu wire bonding corrosion using accelerated Autoclave reliability test.

MLA

Tai, C. T., et al. “Early Detection for Cu Wire Bonding Corrosion Using Accelerated Autoclave Reliability Test.” 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), Jan. 2013, pp. 309–12. EBSCOhost, https://doi.org/10.1109/EPTC.2013.6745733.

APA

Tai, C. T., Lim, H. Y., Teo, C. H., & Audrey Swee, P. J. (2013). Early detection for Cu wire bonding corrosion using accelerated Autoclave reliability test. 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 309–312. https://doi.org/10.1109/EPTC.2013.6745733

Chicago

Tai, C. T., H. Y. Lim, C. H. Teo, and P. J. Audrey Swee. 2013. “Early Detection for Cu Wire Bonding Corrosion Using Accelerated Autoclave Reliability Test.” 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), January, 309–12. doi:10.1109/EPTC.2013.6745733.