An Improved Method for Automatic Detection and Location of Defects in Electronic Components Using Scanning Ultrasonic Microscopy.

Focuses on a method for the automatic analysis and characterization of defects due to encapsulation and surface mount processes of microelectronic devices. Pre-processing of the signals by an algorithm based on the Wiener filtering; Experimental results obtained by applying the proposed method on acoustic signals from an electronic structure acquired through an ultrasonic scanning system; Use of ultrasonic microscope.