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Tunable Peeling Technique and Mechanism of Thin Chip From Compliant Adhesive Tapes.
- Source :
- IEEE Transactions on Components, Packaging & Manufacturing Technology; Apr2014, Vol. 4 Issue 4, p560-568, 9p
- Publication Year :
- 2014
-
Abstract
- The efficient pick-up of thin/ultrathin integrated circuit chip from the wafer is one of the key techniques in advanced microelectronic packaging, whose success rates are determined by the peeling-off of chip from the adhesive tapes. Analytical models for estimating the effects on process parameters represent important design tools. Here, solutions for adhesive stresses and mixed-mode peeling are presented in chip-adhesive-substrate structure based on mixed boundary conditions, in which the geometrical dimensions and material properties of this three-layer system are included. Analytical expressions are defined in terms of structural parameters and several integration constants, which can be obtained by a given system of linear equations. These models agree well with finite element models with virtual crack-closure technique. In particular, the mechanism of tunable mode peeling is uncovered, and the technological limit of normal single ejecting needle is discussed. [ABSTRACT FROM PUBLISHER]
Details
- Language :
- English
- ISSN :
- 21563950
- Volume :
- 4
- Issue :
- 4
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Components, Packaging & Manufacturing Technology
- Publication Type :
- Academic Journal
- Accession number :
- 95319649
- Full Text :
- https://doi.org/10.1109/TCPMT.2014.2298036