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Modeling the thermal conductivity of polymeric composites based on experimental observations.

Authors :
Tsekmes, I.
Kochetov, R.
Morshuis, P.
Smit, J.
Source :
IEEE Transactions on Dielectrics & Electrical Insulation; Apr2014, Vol. 21 Issue 2, p412-423, 12p
Publication Year :
2014

Abstract

One approach to increase the low thermal conductivity of polymers is to add nanosized or microsized fillers with relatively high thermal conductivity. The concept of nanodielectrics is based on the fact that the dielectric behaviour of polymeric composites is tailored on or dictated by nanoscale manipulation. In this paper, the role of fillers in the thermal conductivity of polymeric composites is investigated and reference is made to a number of different studies. The main goal is to determine potential trends governing or dictating the process of thermal conduction in polymeric composites including nanocomposites and microcomposites. Shape, size and thermal conductivity are some of the particle properties considered. Also, the crucial role of interfaces and agglomerations of particles is discussed. Finally, three dimensional models are implemented in Comsol Multiphysics in order to demonstrate the experimental observations and fit the experimental results on the thermal conductivity of epoxy nanocomposites. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
10709878
Volume :
21
Issue :
2
Database :
Complementary Index
Journal :
IEEE Transactions on Dielectrics & Electrical Insulation
Publication Type :
Academic Journal
Accession number :
95634446
Full Text :
https://doi.org/10.1109/TDEI.2013.004142