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Universal NBTI Compact Model for Circuit Aging Simulation under Any Stress Conditions.

Authors :
Ma, Chenyue
Mattausch, Hans Jurgen
Matsuzawa, Kazuya
Yamaguchi, Seiichiro
Hoshida, Teruhiko
Imade, Masahiro
Koh, Risho
Arakawa, Takahiko
Miura-Mattausch, Mitiko
Source :
IEEE Transactions on Device & Materials Reliability; Sep2014, Vol. 14 Issue 3, p818-825, 8p
Publication Year :
2014

Abstract

In this paper, a compact model for the negative bias temperature instability (NBTI) is developed by considering the interface-state generation and the hole-trapping mechanisms. This model shows accurate reproduction of the threshold voltage (Vth) degradations measured from samples fabricated with different dielectric materials as well as processes. A total of eight model parameters are introduced for describing the different degradation origins. The parameter values are verified to exhibit universal properties as a function of the electrical field within the gate oxide (Eox). By implementing the universal NBTI model into the compact model HiSIM, the dynamic NBTI effect and circuit performance degradation can be predicted. [ABSTRACT FROM PUBLISHER]

Details

Language :
English
ISSN :
15304388
Volume :
14
Issue :
3
Database :
Complementary Index
Journal :
IEEE Transactions on Device & Materials Reliability
Publication Type :
Academic Journal
Accession number :
97931368
Full Text :
https://doi.org/10.1109/TDMR.2014.2322673