Cite
The Electrical Specific Action to Melt of Structural Copper and Aluminum Alloys.
MLA
Vanderburg, Andrew, et al. “The Electrical Specific Action to Melt of Structural Copper and Aluminum Alloys.” IEEE Transactions on Plasma Science, vol. 42, no. 10, Oct. 2014, pp. 3167–72. EBSCOhost, https://doi.org/10.1109/TPS.2014.2313292.
APA
Vanderburg, A., Stefani, F., Sitzman, A., Crawford, M., Surls, D., Ling, C., & McDonald, J. (2014). The Electrical Specific Action to Melt of Structural Copper and Aluminum Alloys. IEEE Transactions on Plasma Science, 42(10), 3167–3172. https://doi.org/10.1109/TPS.2014.2313292
Chicago
Vanderburg, Andrew, Francis Stefani, Alex Sitzman, Mark Crawford, Dwayne Surls, Chloe Ling, and Jason McDonald. 2014. “The Electrical Specific Action to Melt of Structural Copper and Aluminum Alloys.” IEEE Transactions on Plasma Science 42 (10): 3167–72. doi:10.1109/TPS.2014.2313292.