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Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives.
- Source :
- Electronic Materials Letters; May2013, Vol. 9 Issue 3, p299-307, 9p
- Publication Year :
- 2013
-
Abstract
- In this study, a matrix resin containing a functional epoxy, a reactive diluent, a silane-coupling agent, and a curing agent was used to fabricate three modal electrically conductive adhesives (ECAs) with micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes (CNT). Results showed that too many micron silver flakes reduced the bulk resistivity and adhesion strength of uni-modal ECAs (matrix resin and micron silver flakes). As the nano silver spheres increased, the bulk resistivity of bi-modal ECAs (matrix resin, micron silver flakes, and nano silver spheres) firstly decreased, and then increased again. The adhesion strength decreased also. The bulk resistivity and adhesion strength of tri-modal ECAs (matrix resin, micron silver flakes, nano silver spheres, and treated CNT) both were reduced by the treated CNT greatly. These ECAs could be cured at 120°C or any higher temperature than this with different curing time. They all had high temperature stability with a pyrolysis temperature above 350°C and a glass transition temperature around 180°C. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 17388090
- Volume :
- 9
- Issue :
- 3
- Database :
- Complementary Index
- Journal :
- Electronic Materials Letters
- Publication Type :
- Academic Journal
- Accession number :
- 99369350
- Full Text :
- https://doi.org/10.1007/s13391-013-2243-y