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An Artificial Simulation Environment Experimental Method for Wallboard Experiments.

Authors :
Li, Cuimin
Zhao, Zhigui
Sun, Zhigao
Source :
Procedia Engineering; 2017, Vol. 205, p101-107, 7p
Publication Year :
2017

Abstract

In order to meet the needs of a large number of wall experiments, this paper presents a simple method to simulate the temperature of the external environment by using the high and low temperature alternating chamber to explore the temperature response of the wallboard. To make the artificial simulation environment similar to the main factors of the natural environment, this paper chooses the appropriate summer external temperature conditions to measure the temperature changes of the actual wall parts of the typical natural environment in summer, and uses the weighted average as the simulation target temperature value. We use the high-low temperature alternating experimental box to simulate the external environment temperature changes, with pure gypsum wallboard inside and high-low temperature alternating experimental box contact to change the high-low temperature alternating chamber box temperature, and record the temperature inside the wall to explore a temperature range that is close to the actual wall temperature. The experimental results show that the temperature change of the inner wall of the wall is close to the actual wall, and can be used as the simulation temperature when the temperature is 18~56℃ and the temperature rise and fall rate is 0.19℃/min. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
18777058
Volume :
205
Database :
Supplemental Index
Journal :
Procedia Engineering
Publication Type :
Academic Journal
Accession number :
125981807
Full Text :
https://doi.org/10.1016/j.proeng.2017.09.940