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Special Section on InterPACK 2017--Part 1.
- Source :
- Journal of Electronic Packaging; Mar2018, Vol. 140 Issue 1, p1-1, 1p
- Publication Year :
- 2018
- Subjects :
- INTEGRATED circuits
INFORMATION technology
Subjects
Details
- Language :
- English
- ISSN :
- 10437398
- Volume :
- 140
- Issue :
- 1
- Database :
- Supplemental Index
- Journal :
- Journal of Electronic Packaging
- Publication Type :
- Academic Journal
- Accession number :
- 128560691
- Full Text :
- https://doi.org/10.1115/1.4039090