Thiacalix[4]arene Etching of an Anisotropic Cu70H22 Intermediate for Accessing Robust Modularly Assembled Copper Nanoclusters.

Details

Language :

English

ISSN :

00027863

Volume :

146

Issue :

5

Database :

Supplemental Index

Journal :

Journal of the American Chemical Society

Publication Type :

Academic Journal

Accession number :

175343760

Full Text :

https://doi.org/10.1021/jacs.3c13965