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High-frequency enhancement for ambient temperature ball bonding.
- Source :
- Semiconductor International; Aug97, Vol. 20 Issue 9, p93, 3p, 2 Color Photographs, 4 Graphs
- Publication Year :
- 1997
-
Abstract
- Focuses on the role of transducers in ball bonding applications. Provision of acoustic energy transfer at frequencies beyond 60 kHz; Advantages of using higher frequencies; Nature of high-energy frequency energy; Explanation for the much improved gold-aluminum reactivity and overall bonded coverage.
- Subjects :
- TRANSDUCERS
Subjects
Details
- Language :
- English
- ISSN :
- 01633767
- Volume :
- 20
- Issue :
- 9
- Database :
- Supplemental Index
- Journal :
- Semiconductor International
- Publication Type :
- Periodical
- Accession number :
- 9712222568