Thermal Transient Response and Its Modeling for Joule Heating in Cu/Low-$\kappa$ Interconnects Under Pulsed Current

We propose a thermal transient response due to Joule heating and its modeling in Cu/low-$\kappa$ interconnects. By incorporating a shape parameter on the model, the observed thermal response is more accurately represented compared to the conventional exponential function model. The effective thermal time constant in multilayered Cu/low-$\kappa$ interconnects is experimentally investigated on the basis of the transient thermal response.