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Inspection of mechanical and electrical properties of silicon wafers using terahertz tomography and spectroscopy
- Source :
- Proceedings of SPIE; May 2015, Vol. 9483 Issue: 1 p94830W-94830W-6, 853477p
- Publication Year :
- 2015
Details
- Language :
- English
- ISSN :
- 0277786X
- Volume :
- 9483
- Issue :
- 1
- Database :
- Supplemental Index
- Journal :
- Proceedings of SPIE
- Publication Type :
- Periodical
- Accession number :
- ejs36121048
- Full Text :
- https://doi.org/10.1117/12.2176999