Functional Design of Dielectric–Metal–Dielectric-Based Thin-Film Encapsulation with Heat Transfer and Flexibility for Flexible Displays

MLA

Kwon, Jeong Hyun, et al. “Functional Design of Dielectric–Metal–Dielectric-Based Thin-Film Encapsulation with Heat Transfer and Flexibility for Flexible Displays.” ACS Applied Materials & Interfaces, no. Preprints, Jan. 2024. EBSCOhost, https://doi.org/10.1021/acsami.7b06076.

APA

Kwon, J. H., Choi, S., Jeon, Y., Kim, H., Chang, K. S., & Choi, K. C. (2024). Functional Design of Dielectric–Metal–Dielectric-Based Thin-Film Encapsulation with Heat Transfer and Flexibility for Flexible Displays. ACS Applied Materials & Interfaces, Preprints. https://doi.org/10.1021/acsami.7b06076

Chicago

Kwon, Jeong Hyun, Seungyeop Choi, Yongmin Jeon, Hyuncheol Kim, Ki Soo Chang, and Kyung Cheol Choi. 2024. “Functional Design of Dielectric–Metal–Dielectric-Based Thin-Film Encapsulation with Heat Transfer and Flexibility for Flexible Displays.” ACS Applied Materials & Interfaces, no. Preprints (January). doi:10.1021/acsami.7b06076.