Back to Search
Start Over
Use of MIR-FTIR and k-value Measurements to Assess Potential Solutions to Reduce Damage During Porous Low-k Integration
- Source :
- ECS Transactions; March 2009, Vol. 18 Issue: 1 p275-280, 6p
- Publication Year :
- 2009
-
Abstract
- Multiple Internal Reflection (MIR) FTIR is used to assess the impact of potentially damaging BEOL integration process steps such as Chemical Mechanical Polishing (CMP) and NH3-based plasmas on a k=2.55 porous interlayer dielectric. The NH3 plasma is found to be very damaging, and a He plasma prior to the same NH3 plasma leads to a damage reduction. The impact of CMP is also confirmed and leads to an equivalent k-value degradation as a He + NH3 plasma. In order to reduce the integration damage, the addition of a low-k protective cap layer (k=3.3) is proposed. The required thickness to avoid impact from CMP and NH3-based plasmas is found to be 10 nm after CMP (Kstack=2.60 with 10 nm cap). As a result, those process steps are no longer a concern with this integration route.
Details
- Language :
- English
- ISSN :
- 19385862 and 19386737
- Volume :
- 18
- Issue :
- 1
- Database :
- Supplemental Index
- Journal :
- ECS Transactions
- Publication Type :
- Periodical
- Accession number :
- ejs52651571