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A physics-based electromigration reliability model for interconnects lifetime prediction

Authors :
Cai, Linlin
Chen, Wangyong
Kang, Jinfeng
Du, Gang
Liu, Xiaoyan
Zhang, Xing
Source :
SCIENCE CHINA Information Sciences; November 2021, Vol. 64 Issue: 11
Publication Year :
2021

Details

Language :
English
ISSN :
1674733X and 18691919
Volume :
64
Issue :
11
Database :
Supplemental Index
Journal :
SCIENCE CHINA Information Sciences
Publication Type :
Periodical
Accession number :
ejs58072692
Full Text :
https://doi.org/10.1007/s11432-020-3140-4