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A physics-based electromigration reliability model for interconnects lifetime prediction
- Source :
- SCIENCE CHINA Information Sciences; November 2021, Vol. 64 Issue: 11
- Publication Year :
- 2021
Details
- Language :
- English
- ISSN :
- 1674733X and 18691919
- Volume :
- 64
- Issue :
- 11
- Database :
- Supplemental Index
- Journal :
- SCIENCE CHINA Information Sciences
- Publication Type :
- Periodical
- Accession number :
- ejs58072692
- Full Text :
- https://doi.org/10.1007/s11432-020-3140-4