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Enhanced Optoelectronic Performance Induced by Ion Migration in Lead-Free CsCu2I3Single-Crystal Microrods

Authors :
Yan, Shan-Shan
Kong, You-Chao
Zhang, Zhi-Hong
Wu, Zhi-Sheng
Lian, Zhen-Dong
Zhao, Yun-Peng
Su, Shi-Chen
Li, Lin
Wang, Shuang-Peng
Ng, Kar Wei
Source :
ACS Applied Materials & Interfaces; 20240101, Issue: Preprints
Publication Year :
2024

Abstract

Lead-free perovskite has attracted great attention in realizing high-performance optoelectronic devices due to their excellent atmospheric stability and nontoxic characteristics. Although a pronounced ion migration effect has been observed in this new class of materials, its potential in enhancing the overall device performance is yet to be fully explored. In this work, we studied the effect of ion migrations on the carrier transport behavior and found that the recoverable migration process can contribute to enhancing the on/off ratio in a lead-free CsCu2I3single-crystal microrod-based photodetector. In detail, we synthesized CsCu2I3single-crystal microrods via an in-plane self-assembly supersaturated crystallization approach. These microrods with well-defined morphologies were then used to construct ultraviolet (UV)-band photodetectors, which outperform most reported lead-free perovskite photodetectors based on individual single crystals. Simultaneously, ion migration can result in asymmetric band bending in the two-terminal device, as confirmed by surface potential profiling with Kelvin probe force microscopy (KPFM). Such an effect can be harnessed to increase the on/off ratio by almost an order of magnitude. Furthermore, the lead-free CsCu2I3single crystal exhibits excellent thermal and air stabilities. These findings demonstrate that the CsCu2I3single-crystal microrods can be used in stable and efficient photodetection, and the ion migration effect can potentially be utilized for improving the optoelectronic performance of lead-free devices.

Details

Language :
English
ISSN :
19448244
Issue :
Preprints
Database :
Supplemental Index
Journal :
ACS Applied Materials & Interfaces
Publication Type :
Periodical
Accession number :
ejs61066974
Full Text :
https://doi.org/10.1021/acsami.2c14974