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Film Boiling Suppression and Boiling Heat Transfer Enhancement by Dielectrophoretic Effect

Authors :
Nguyen, T.B.
Vo, Q.
Shang, X.
Buang, F.
Tran, T.
Source :
Thermal Science and Engineering Progress; 20230101, Issue: Preprints
Publication Year :
2023

Abstract

•A novel and robust method that both enhances boiling heat transfer and suppresses film boing using the dielectrophoretic effect.•Completely bypass film boiling and switch to nucleate boiling.•Heat transfer efficiency can be adjusted dynamically during the thermal system operation.•Heat flux enhancement up to 200% can be achieved using dielectrophoretic effect.

Details

Language :
English
ISSN :
24519049
Issue :
Preprints
Database :
Supplemental Index
Journal :
Thermal Science and Engineering Progress
Publication Type :
Periodical
Accession number :
ejs62532789
Full Text :
https://doi.org/10.1016/j.tsep.2023.101796