Back to Search Start Over

Effect of liquid solder on shear strength of solder/Cu porous joint

Authors :
Chen, Wanmi
Liu, Xiaogang
Jiang, Wenpeng
He, Siliang
Xiong, Bifu
Yang, Jiale
Guo, Chan
Source :
Proceedings of SPIE; April 2024, Vol. 13082 Issue: 1 p130822F-130822F-5, 1177404p
Publication Year :
2024

Details

Language :
English
ISSN :
0277786X
Volume :
13082
Issue :
1
Database :
Supplemental Index
Journal :
Proceedings of SPIE
Publication Type :
Periodical
Accession number :
ejs66002043
Full Text :
https://doi.org/10.1117/12.3026238