Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework

Laser rework (LR) and hot air rework (HR) process impact on the nearby ball grid array (BGA) rework components with lead-free solder Sn3.0Ag0.5Cu (SAC305) solder joints were investigated in these studies. Reworking BGA components is a challenging procedure with additional implications for printed circuit board assembly (PCBA) reliability due to the thermal exposure affecting the nearby rework components’ solder joints’ qualities. In these studies, we examined thermal exposure effects on nearby BGA rework components and analyzed the solder joint qualities after the rework process by observing the dye penetration percentage along with the separation location on the solder joints. The successful outcomes of the dye and pull (DnP) tests show the LR method on BGA components is reliable for high-density PCBA design with up to 15% reduction on the impacted solder joints and 24 °C lesser on the peak temperature for the nearby BGA rework components compared to the HR performance.