Enhanced Corrosion Protection of Printed Circuit Board Electronics using Cold Atmospheric Plasma-Assisted SiOxCoatings

MLA

Kasi, Venkat, et al. “Enhanced Corrosion Protection of Printed Circuit Board Electronics Using Cold Atmospheric Plasma-Assisted SiOxCoatings.” ACS Applied Materials & Interfaces, vol. 16, no. 36, Sept. 2024, pp. 48293–306. EBSCOhost, https://doi.org/10.1021/acsami.4c09751.

APA

Kasi, V., Tien, J.-H., Rahman, M. M., Rana, M. M., Heredia Rivera, U. A., Shang, Z., Vidhyadhiraja, A., Zhang, J., Youngblood, J. P., Bahr, D. F., & Rahimi, R. (2024). Enhanced Corrosion Protection of Printed Circuit Board Electronics using Cold Atmospheric Plasma-Assisted SiOxCoatings. ACS Applied Materials & Interfaces, 16(36), 48293–48306. https://doi.org/10.1021/acsami.4c09751

Chicago

Kasi, Venkat, Jia-Huei Tien, Md Mahabubur Rahman, Muhammad Masud Rana, Ulisses Alberto Heredia Rivera, Zhongxia Shang, Advika Vidhyadhiraja, et al. 2024. “Enhanced Corrosion Protection of Printed Circuit Board Electronics Using Cold Atmospheric Plasma-Assisted SiOxCoatings.” ACS Applied Materials & Interfaces 16 (36): 48293–306. doi:10.1021/acsami.4c09751.