Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review

MLA

Wang, Meiyu, et al. “Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review.” Components, Packaging, and Manufacturing Technology, IEEE Transactions On, vol. 14, no. 9, Sept. 2024, pp. 1537–50. EBSCOhost, https://doi.org/10.1109/TCPMT.2024.3447079.

APA

Wang, M., Gao, P., Shi, F., Hu, W., Wang, X., Yan, H., & Mei, Y. (2024). Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review. Components, Packaging, and Manufacturing Technology, IEEE Transactions On, 14(9), 1537–1550. https://doi.org/10.1109/TCPMT.2024.3447079

Chicago

Wang, Meiyu, Peng Gao, Fangmin Shi, Weibo Hu, Xudong Wang, Haidong Yan, and Yunhui Mei. 2024. “Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review.” Components, Packaging, and Manufacturing Technology, IEEE Transactions On 14 (9): 1537–50. doi:10.1109/TCPMT.2024.3447079.