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Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Authors :
Yan, J.
Zou, G.
Wang, X.
Mu, F.
Bai, H.
Wu, A.
Hu, A.
Norman Y. Zhou
Source :
Scopus-Elsevier

Details

Database :
OpenAIRE
Journal :
Scopus-Elsevier
Accession number :
edsair.dedup.wf.001..1454b34b826f3453d4493e29654a0302

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