Silicon chip built-in heat spreader: characterization and optimization using integrated sensors

Authors :: Bercu, B.
Montes, L.
Morfouli, P.
Domenget, Chahla
Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation (IMEP-LAHC)
Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Institut National Polytechnique de Grenoble (INPG)-Centre National de la Recherche Scientifique (CNRS)
Source :: 3rd European Advanced Technology Workshop on Micropackaging and Thermal Management La Rochelle, France, 3rd European Advanced Technology Workshop on Micropackaging and Thermal Management La Rochelle, France, Jan 2008,-, France
Publication Year :: 2008
Publisher :: HAL CCSD, 2008.
Abstract: International audience

Subjects :: [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
[SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
ComputingMilieux_MISCELLANEOUS

Language :: English
Database :: OpenAIRE
Journal :: 3rd European Advanced Technology Workshop on Micropackaging and Thermal Management La Rochelle, France, 3rd European Advanced Technology Workshop on Micropackaging and Thermal Management La Rochelle, France, Jan 2008,-, France
Accession number :: edsair.dedup.wf.001..5036c8255f9f432dfd5f6d1a6e68847b

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