Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2009)

ISBN: 978-2-35500-009-6; This Symposium is a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006 and in 2007 in Stresa, Italy and in 2008 in Nice, France. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. We hope you enjoy the technical presentations of 2 conferences - CAD, Design and Test / Microfabrication, Integration and Packaging -, of 2 joint invited talks, and of a special session on 3D Integration of MEMS.