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Evaluating the accuracy of a non-destructive thermocouple attach method for array package profiling

Authors :
Manian S
Grove, T.
O Leary, B.
Source :
Scopus-Elsevier

Details

Database :
OpenAIRE
Journal :
Scopus-Elsevier
Accession number :
edsair.dedup.wf.001..97ed9d34aef892b93babbedf511803c4

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