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Bulk Bi2Te3-based bendable thermoelectric device with highly elastic Cu-Be alloy foils

Authors :
Yen Ngoc Nguyen
Jaehoon Park
Sung Hwa Bae
Dongyeon Kim
Khanh Quoc Dang
Injoon Son
Source :
Materials Today Communications. 34:105408
Publication Year :
2023
Publisher :
Elsevier BV, 2023.

Subjects

Subjects :
Mechanics of Materials
Materials Chemistry
General Materials Science

Details

ISSN :
23524928
Volume :
34
Database :
OpenAIRE
Journal :
Materials Today Communications
Accession number :
edsair.doi...........06c712a31f4e89f310d2d08ae8943400

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